Dual wafer load lock

ABSTRACT

A method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body having a first port disposed in a first wall and a second port disposed in a second wall that seals the chamber from the first and second environments. A cooling plate, a first substrate holder and a second substrate holder are disposed within the chamber body. The cooling plate is disposed at the bottom of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window is disposed in the top of the chamber body that allows a metrology device to view the chamber volume.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.09/906,887, filed Jul. 16, 2001, now U.S. Pat. No. 6,558,509 which is acontinuation-in-part of copending U.S. patent application Ser. No.09/451,628, filed Nov. 30, 1999. Each of the aforementioned relatedpatent applications is herein incorporated by reference.

BACKGROUND OF THE DISCLOSURE

1. Field of Invention

The embodiments of the invention generally relate to a method andapparatus for transferring substrates in a semiconductor processingsystem.

2. Background of Invention

Semiconductor substrate processing is typically performed by subjectinga substrate to a plurality of sequential processes to create devices,conductors and insulators on the substrate. These processes aregenerally performed in a process chamber configured to perform a singlestep of the production process. In order to efficiently complete theentire sequence of processing steps, a number of process chambers aretypically coupled to a central transfer chamber that houses a robot tofacilitate transfer of the substrate between the surrounding processchambers. A semiconductor processing platform having this configurationis generally known as a cluster tool, examples of which are the familiesof PRODUCER®, CENTURA® and ENDURA® processing platforms available fromApplied Materials, Inc., of Santa Clara, Calif.

Generally, a cluster tool consists of a central transfer chamber havinga robot disposed therein. The transfer chamber is generally surroundedby one or more process chambers. The process chambers are generallyutilized to sequentially process the substrate, for example, byperforming various processing steps such as etching, physical vapordeposition, chemical vapor deposition, ion implantation, lithography andthe like. As the processes performed in the process chambers aregenerally performed at vacuum pressure, the transfer chamber ismaintained at vacuum pressure as well to eliminate having to repeatedlypump down the process chamber for each substrate transfer. This ispartially important as pumping down the transfer chamber may require asmuch as eight hours to reach operational vacuum levels.

Load lock chambers are generally used to facilitate transfer of thesubstrates between the vacuum environment of the transfer chamber and anenvironment of a factory interface wherein substrates are stored incassettes. The factory interface is typically at or near atmosphericpressure. The load lock chambers are selectively isolated from thefactory interface and transfer chamber by slit valves. Generally, atleast one slit valve is maintained in a closed position to prevent lossof vacuum in the transfer chamber during substrate transfer through theload lock. For example, an interface slit valve is opened while achamber slit valve is closed to allow an interface robot to transfersubstrates between the load lock chamber and the substrate storagecassettes disposed in the factory interface. After the substrate isloaded from the interface robot, both slit valves are closed as the loadlock chamber is evacuated by a pump to a vacuum level substantiallyequal to that of the transfer chamber. The substrate in the evacuatedload lock is passed into the transfer chamber by opening the chamberslit valve while the interface slit valve remains closed. Processedsubstrates are returned to the factory interface in the reverse manner,wherein the load lock chamber is vented to substantially equalize thepressure between the load lock chamber and the factory interface.

There are generally two types of load lock chambers utilized tointerface with the transfer chamber. A first type is known as abatch-type load lock chamber. The batch-type chamber generally holds anentire substrate storage cassette within the chamber. The cassette isloaded into the load lock chamber and the chamber is sealed and pumpeddown to an appropriate vacuum level. The chamber is then opened to thetransfer chamber so that the robot within the transfer chamber mayfreely access any of the substrates and storage slots within thecassette until all of the substrates within the cassette have beenprocessed. After all the substrates have been returned to the cassette,the load lock chamber is isolated from the transfer chamber tofacilitate replacing the cassette with another cassette containingsubstrates to be processed. While the cassettes are being exchanged, thetransfer robot typically draws substrates from a cassette disposed in asecond load lock chamber coupled to the transfer chamber.

The use of batch-type load lock chambers is generally a robust andeffective system for transferring substrates into the transfer chamber.However, due to the relatively large internal volume required toaccommodate the entire substrate cassette, pump-down times are long andthe associated pumping hardware is large and costly. Additionally,venting of the large internal volume increases the chance of particulatecontamination and condensation on the substrates.

The second type of load lock chamber is known as a singlesubstrate-type. Generally, the single substrate-type load lock chambershuttles one processed and one unprocessed substrate therethrough eachtime the load lock chamber is pumped down. To maintain high systemthroughput, single substrate-type load lock chambers are typically usedin tandem. This allows a first load lock chamber to exchange substrateswith the transfer chamber while a second load lock chamber exchangessubstrates with the factory interface wherein the substrate storagecassettes are positioned.

Cluster tools often utilize more than one load lock to maintain highsubstrate transfer rates between the factory interface and the transferchamber. However, the second load lock occupies a position on thetransfer chamber at the expense of an additional process chamberthroughput and process versatility is sacrificed. Thus, if one of theload lock chambers could be eliminated without loss of substrateexchange rates between the transfer chamber and factory interface, anadditional process chamber could be utilized in the open facet of thetransfer chamber, thus enhancing system throughput and versatility.Moreover, utilizing a single load lock chamber would advantageouslyreduce the cost of ownership for the system.

Therefore, there is a need for an improved load lock chamber.

SUMMARY OF INVENTION

In one aspect, the invention generally provides an apparatus fortransferring a substrate between a first environment having a firstpressure and a second environment having a vacuum pressure. In oneembodiment, the apparatus comprises a chamber body having a first sidewall, a second side wall, a top and a bottom defining a chamber volumetherebetween. A first port is disposed in the first wall and selectivelyseals the chamber volume from the first environment. A second port isdisposed in the second wall and selectively seals the chamber volumefrom the second environment. A temperature control pedestal, a firstsubstrate holder and a second substrate holder are disposed between thetop and the bottom of the chamber body. The second substrate holder isdisposed between the top of the chamber body and the first substrateholder. The temperature control pedestal is disposed between the bottomof the chamber body and the first substrate holder. The first port andthe second port are sequentially opened and the pressure within the loadlock regulated to allow substrates to pass through the load lockchamber. A window is disposed in the top of the chamber body that allowsa metrology device to view the chamber volume.

In another aspect, a method for transferring semiconductor substratesbetween a first environment having a first pressure and a secondenvironment having a vacuum pressure using a single load lock chamber isprovided. In one embodiment, the method includes transferring aprocessed substrate from the second environment to a second substrateholder disposed in the chamber, moving a cooling plate to contact theprocessed substrate, venting the chamber, and removing the processedsubstrate into the first environment.

BRIEF DESCRIPTION OF DRAWINGS

The teachings of the present invention can readily be understood byconsidering the following detailed description in conjunction with theaccompanying drawings in which:

FIG. 1 depicts a plan view of a substrate processing system thatincludes one embodiment of a load lock chamber of the invention;

FIG. 2 depicts a sectional view of the load lock chamber of FIG. 1;

FIG. 3 depicts a sectional view of one embodiment of a heater module;and

FIG. 4 depicts a sectional view of another embodiment of a load lockchamber.

To facilitate understanding, identical reference numerals have beenused, wherever possible, to designate identical elements that are commonto the figures.

DETAILED DESCRIPTION OF INVENTION

FIG. 1 depicts a processing system 100 that generally includes a factoryinterface 102, one or more load lock chambers 106, a plurality ofprocess chambers 108 and a substrate transfer chamber 104. The transferchamber 104 is generally used to transfer substrates 124 between avacuum environment maintained in the transfer chamber 104 and asubstantially ambient environment maintained in the factory interface102. One example of a processing system that may be adapted to benefitfrom the invention is an ENDURA SL® processing platform, available fromApplied Materials, Inc., of Santa Clara, Calif. Although the load lockchamber 106 is described in reference to the exemplary processing system100 depicted in FIG. 1, the load lock chamber 106 has utility in othersystems or wherever transfer of substrates between vacuum and ambientenvironments is desired.

The factory interface 102 generally includes an interface robot 120 anda plurality of bays 128. Each bay 128 is adapted to receive a substratestorage cassette 130. Generally, the factory interface 102 is coupled tothe load lock chamber 106 through a side wall 136 that is positionedopposite the bays 128. The interface robot 120 is disposed in aninterior volume 116 of the factory interface 102 that is maintained at asubstantially ambient pressure. The interface robot 120 includes atleast a first gripper 110 coupled thereto. Generally, the first gripper110 may be an edge gripper, vacuum gripper or other substrate securingdevice used to hold the substrate 124 during transfer. The interfacerobot 120 is generally positioned between the side wall 136 and bays 128to facilitate transfer of substrates between the cassettes 130 and theload lock 106. An example of one factory interface that may be adaptedto benefit from the invention is described in U.S. patent applicationSer. No. 09/161,970, filed Sep. 28, 1998 by Kroeker, which is herebyincorporated by reference in its entirety.

The transfer chamber 104 is generally fabricated from a single piece ofmaterial such as aluminum. The transfer chamber 104 generally includesside walls 150 and chamber bottom 156. A lid 138 (shown in FIG. 2) issupported by the side walls 150 and, with the side wall 150 and chamberbottom 156, define an evacuable interior volume 122 therebetween.Substrates 124 are transferred between the process chambers 108 and loadlock chambers 106 coupled to the exterior of the chamber 104 through thevacuum maintained within the volume 122.

At least one transfer robot 112 is disposed in the transfer chamber 104to facilitate transfer of substrates between the process chambers 108.The transfer robot 112 has at least one end effector such as a gripperor a blade 114 for securing the substrate during transfer. The transferrobot 112 typically has a “frog-leg” linkage that is commonly used totransfer substrates in vacuum environments. The transfer robot 112 isgenerally disposed in the interior volume 122 of the transfer chamber104 and has a range of motion that allows the substrate 124 to betransferred between the load lock 106 and the process chambers 108. Inone embodiment, the transfer chamber 104 includes two transfer robots112 each having dual blades 114.

The process chambers 108 are typically fastened to an exterior side 152of the side walls 150 of the transfer chamber 104. Examples of processchambers 108 that may be utilized are etching chambers, physical vapordeposition chambers, chemical vapor deposition chambers, ionimplantation chambers, lithography chambers and the like. Differentprocess chambers 108 may be coupled to the transfer chamber 104 toprovide a processing sequence necessary to form a predefined structureor feature upon the substrate's surface. An aperture (not shown) isdisposed in the side wall between each process chamber 108 (or otherchambers) to allow the substrate to be passed between the processchamber 108 and interior volume 122 of the transfer chamber 104. A slitvalve 132 selectively seals each aperture to maintain isolation betweenthe environments of the chambers 108, 104 between substrate transfersand during processing within the process chambers 108. One slit valvethat may be used to advantage is described in U.S. Pat. No. 5,226,632,issued Jul. 13, 1993 to Tepman, et al., which is hereby incorporated byreference in its entirety.

Generally, a pumping system 142 is coupled to the transfer chamber 104to evacuate and maintain the chamber at a predetermined vacuum level.Typically, a pumping port 140 is centrally disposed in the chamberbottom 156 to fluidly couple the interior volume 122 to the pumpingsystem 142. The pumping system 142 may include one or more pumps such asa roughing pump, a turbomolecular pump or a cryogenic pump.

The load lock chamber 106 is generally coupled between the factoryinterface 102 and the transfer chamber 104. The load lock chamber 106 isgenerally used to facilitate transfer of the substrates 124 between avacuum environment which is maintained in the interior volume 122 of thetransfer chamber 104 and an environment of the factory interface 102rapidly without loss of vacuum within the transfer chamber.

FIG. 2 depicts one embodiment of the load lock chamber 106. The loadlock chamber 106 generally comprises a chamber body 202, a firstsubstrate holder 204, a second substrate holder 206, a temperaturecontrol pedestal 240 and a heater module 270. The chamber body 202 ispreferably fabricated from a singular body of material such as aluminum.The chamber body 202 includes a first side wall 208, a second side wall210, lateral walls (242 in FIG. 3), a top 214 and a bottom 216 thatdefine a chamber volume 218. A window 250, typically comprised ofquartz, is disposed in the top 216 of the chamber body 202 and is atleast partially covered by the heater module 270.

The atmosphere of the chamber volume 218 is controlled so that it may beevacuated to substantially match the environment of the transfer chamber104 and be vented to substantially match the environment of the factoryinterface 102. Generally, the chamber body 202 includes a vent passage230 and a pump passage 232. Typically, the vent passage 230 and the pumppassage 232 are positioned at opposite ends of the chamber body 202 toinduce laminar flow within the chamber volume 218 during venting andevacuation to minimize particulate contamination. In one embodiment, thevent passage 230 is disposed through the top 214 of the chamber body 202while the pump passage 232 is disposed through the bottom 216 of thechamber body 202. The passages 230, 232 typically are coupled to a valve212 to selectively allow flow into and out of the chamber volume 218.Alternatively, the passages 230, 232 may be positioned at opposite endsof one of the chamber walls, or on opposing or adjacent walls.

In one embodiment, the vent passage 230 is coupled to a high efficiencyair filter 234 such as available from Camfil-Farr, of Riverdale, N.J.The pump passage 232 is coupled to a point-of-use pump 236 such asavailable from Alcatel, headquartered in Paris, France. The point-of-usepump 236 has low vibration generation to minimize the disturbance of thesubstrates 124 positioned within the load lock chamber 106 whilepromoting pump-down efficiency and time by minimizing the fluid pathbetween the chamber 106 and pump 234 to generally less than three feet.

A first loading port 238 is disposed in the first wall 208 of thechamber body 202 to allow substrates 124 to be transferred between theload lock 106 and the factory interface 102. A first slit valve 244selectively seals the first loading port 238 to isolate the load lock106 from the factory interface 102. A second loading port 239 isdisposed in the second wall 210 of the chamber body 202 to allowsubstrates 124 to be transferred between the load lock 106 and thetransfer chamber 104. A second slit valve 146 which is substantiallysimilar to the first slit valve 244 selectively seals the second loadingport 239 to isolate the load lock 106 from the vacuum environment of thetransfer chamber 104. One slit valve that may be used to advantage isdescribed in U.S. Pat. No. 5,226,632, issued Jul. 13, 1993 to Tepman etal., which is hereby incorporated by reference in its entirety.

Generally, the first substrate holder 204 is concentrically coupled to(i.e., stacked on top of) the second substrate holder 206 that isdisposed above the chamber bottom 216. The substrate holders 204 and 206are generally mounted to a hoop 220 that is coupled to a shaft 284 thatextends through the bottom 216 of the chamber body 202. Typically, eachsubstrate holder 204, 206 is configured to retain one substrate. Theshaft 284 is coupled to a lift mechanism 294 that controls the elevationof the substrate holders 204 and 206 within the chamber body 206. Abellows 284 is generally disposed around the shaft 284 to preventleakage from or into the body 206.

Typically, the first substrate holder 204 is utilized to hold anunprocessed substrate while the second substrate holder 206 is utilizedto hold a processed substrate returning from the transfer chamber 104.The flow within the load lock 106 during venting and evacuation issubstantially laminar due to the position of the vent passage 230 andpump passage 232 and is configured to minimize particulatecontamination.

FIG. 3 depicts one embodiment of the substrate holders 204, 206. Thesecond substrate holder 206 is generally held above the bottom 216 ofthe chamber body 202 by the hoop 220. A first standoff 308 is disposedbetween each member 304, 306 to maintain the second substrate holder 206in a spaced-apart relation to the hoop 220. A second standoff 310 isdisposed between the first and second substrate holders 204, 206 tomaintain a spaced-apart relation therebetween. Generally, the standoffs308, 310 allow grippers 110, 114 of the transfer and factory interfacerobots 112, 120 to pass therebetween when retrieving and depositingsubstrates on the substrate holders 204, 206.

Generally, each substrate holder 204, 206 includes a first member 304and a second member 306. Each holder 204, 206 may have alternativelyinclude a “L-shaped” configuration that incorporates a portion thatmaintains a spaced-apart relation between holder 204, 206 and adjacentcomponents of the load lock 106.

Each member 304, 306 includes a curved inner portion 312 that has a lip314 extending radially inwards therefrom. The curved inner portion 312is generally configured to allow the substrate 124 to pass therebetweenand rest on the lip 314. The curved inner portion 312 captures thesubstrate 124 therebetween, thus preventing the substrate 124 fromfalling off the lip 314.

Referring back to FIG. 2, the temperature control pedestal 240 istypically coupled to the bottom 216 of the chamber body 202 by a support278. The support 278 may be hollow or include passages therethrough toallow fluids, electrical signals, sensor and the like to be coupled tothe pedestal 240. Alternatively, the pedestal 240 may be movably coupledto the chamber body 202.

The temperature control pedestal 240 generally includes a platen 280which is generally fabricated from a thermally conductive material suchas aluminum or stainless steel but may alternatively be comprised ofother materials such as ceramic. The platen 280 generally has a heattransfer element 286 such as fluid passage disposed in the platen 280 ordisposed in contact with a lower surface 288 of the platen 280.Alternatively, the heat transfer element 286 may be a circulated waterjacket, a thermoelectric device such as a Peltier device or otherstructure that may be utilized to control the temperature of the platen280.

In one embodiment, the heat transfer element 286 comprises a tube 290disposed proximate the lower surface 288 of the platen 280. The tube 290is coupled to a fluid source 294 that circulates a fluid through thetube. The fluid, for example facility water from the fluid source 294,may optionally be thermally regulated. The tube 290 may be disposed in asubstantially circular or spiral pattern against the lower surface 288of the platen 280. Typically, the tube 290 is brazed to the lowersurface 288 or adhered using a conductive adhesive. Optionally, aconductive plate (not shown) such as a copper plate may alternatively bedisposed between the tube 290 and platen 280 to promote uniformity ofheat transfer across the width of the platen 280.

The hoop 220 having the substrate holders 204, 206 coupled thereto maybe lowered to a first position where an upper surface 292 of the platen280 is in close proximity or in contact with the substrate supported bythe second substrate holder 206. In the first position, the platen 280may be used to regulate the temperature of the substrate disposed on (orproximate to) the platen 280. For example, a substrate returning fromprocessing may be cooled in the load lock chamber 106 by supporting thesubstrate during the evacuation of the chamber 106 on the upper surface292 of the platen 280. Thermal energy is transferred from the substratethrough the platen 280 to the heat transfer element 286, thereby coolingthe substrate. After cooling the substrate, the substrate holders 204,206 may be raised towards the top 214 of the chamber body 202 to allowthe robots 112, 120 access to the substrate seated in the secondsubstrate support 206. Alternatively, the substrate may be heated.Optionally, the holders 204, 206 may be lowered to a position where theupper surface 292 is in contact or close proximity to the substratesupported by the first substrate holder 204. In this position, theplaten 280 may be used to thermally regulate the substrate.

The shaft 282 generally couples the substrate holders 204, 206 to a liftmechanism 296 disposed exterior to the load lock chamber 106. Thebellows 284 are coupled between the second substrate holder 206 and thebottom 216 of the chamber body 202 and provide a flexible sealtherebetween, thus facilitating raising and lowering the substrateholders 204, 206 without compromising the pressure within the load lockchamber 106.

FIG. 4 depicts a sectional view of one embodiment of the heater module270. The heater module 270 is generally disposed on the top 214 of theload lock chamber 106. The heater module 270 may alternatively comprisevarious types of radiant heaters. In one embodiment, the heater module270 includes a housing 402 having a lamp 404 disposed therein. Thehousing 402 generally includes sides 406 and a top 408 that define aninterior 430. The sides 406 are generally coupled to the top of thechamber body. An aperture 412 is disposed in the top 408 of the heatermodule 270 to facilitate power connection to the lamp 402. The lamp 402is generally coupled to a power source 432 by a ceramic socket 414.

A cooling device 416 is coupled to the socket 414 to control thetemperature rise of the lamp 402 to extend the life of the lamp 402. Inone embodiment, the cooling device 416 is an annular plate 418 havinggood thermal conductivity that is thermally regulated by a circulatingfluid. In one embodiment, the annular plate 418 is a copper disk havinga tube 420 brazed to the perimeter of the plate 418. The fluid iscirculated through the tube 420 from a fluid source 434 therebyregulating the temperature of the plate 418. Alternatively, the coolingdevice 416 may include thermoelectric devices, heat sinks, water jacketsand other devices that limit the temperature rise of the socket 414.

The socket 414 is typically biased against the plate 418 to promote heattransfer therebetween. In one embodiment, a shoulder screw 422 isdisposed through the socket 414 and plate 418 and threads into the top408 of the housing 402. To accommodate thermal expansion between thesocket 414 and plate 418, one or more springs 424 are disposed between ahead 426 of the shoulder screw 422 and the socket 414. The spring 424,which may be a coil, flat, belliville or other basising device,maintains contact between the socket 414 and plate 418 over a wide rangeof temperature without damaging the socket 414.

FIG. 4 additionally depicts another embodiment of a temperature controlpedestal 450. The temperature control pedestal 450 is substantiallysimilar to the temperature control pedestal 240 described with referenceto FIG. 2 except that the temperature control pedestal 450 rotates. Inone embodiment, the pedestal 450 generally includes an upper portion 452and a lower portion 454. The lower portion is generally stationary andis coupled a bottom 456 of the chamber. A rotary actuator 458 isdisposed between the upper portion 452 and lower portion 454 of thepedestal 450. The rotary actuator 458 generally provides rotary motionto the upper portion 452 of the pedestal 450. When the second substrateholder 206 is lowered to dispose the substrate 124 on the upper portion452, the upper portion 452 rotates the substrate 124. The rotaryactuator 458 may be a solenoid, air motor, electric motor or otherdevice that induces rotary motion to the upper portion 452 of thepedestal 450. Alternatively, the rotary actuator 458 may be disposedremote to the load lock chamber and configured to rotate the upperportion 452 of the pedestal 450 via a linkage (not shown) disposedthrough the bottom 456.

A metrology device 428 is disposed proximate the window. The metrologydevice 428 may be a wafer type sensor, a wafer orientation sensor, awafer center sensor, a wafer location sensor, a film thickness detector,a topography detector or other device utilized to detect attributes ofthe substrate disposed in the load lock chamber. Generally, themetrology device 428 is disposed proximate the heater module 270 andpositioned to view the substrate through the window. Alternatively, themetrology device 428 may be disposed in the heater module 270.

In one embodiment, the metrology device 428 includes a sensor 490disposed outside of the chamber 106 and positioned to view the substratesupported on the pedestal 450 through the window 250 disposed in the top214 of the chamber body 202. As the pedestal 450 rotates the substrate,the sensor 490 projects a beam 492 to the perimeter of the substrate124. The orientation of the substrate is determined by detectingvariations in a portion 494 of beam 492 reflected off the substrate dueto features such as notches or flats (not shown) in the perimeter of thesubstrate.

Referring primarily to FIG. 2, in operation, the load lock 106 generallyfacilitates the transfer of substrates between the ambient atmosphere ofthe factory interface and the vacuum atmosphere of the transfer chamber.The load lock 106 temporarily houses the substrate while the atmospherewithin the load lock 106 is adjusted to match the atmosphere of thechamber into which the substrate is to be transferred.

For example, the slit valve 244 is opened while the load lock 106 isvented to substantially atmospheric pressure to match the atmosphere ofthe factory interface 102. The factory interface robot 120 transfers anunprocessed substrate from one of the cassettes 130 to the firstsubstrate holder 204. A processed substrate is removed from the secondsubstrate holder 206 by the factory interface robot 120 and returned toone of the cassettes 130. After completion of the substrate transfer,the slit valve 244 and vent passage 230 are closed. The pump passage 232is opened and the load lock chamber 106 is pumped down to the pressuresubstantially equal to the pressure of the transfer chamber 104. Duringpump down, the heater module 270 heats the substrate residing in thefirst substrate holder 204. The metrology device 428 (seen in FIG. 4)may be utilized to determine the substrate's center or other substratemetric.

Once the pressures within the load lock 106 and transfer chamber 104 aresubstantially equal, the slit valve 246 is opened. A processed substrateis positioned in the second substrate holder 206 by the transfer robot112. The transfer robot 112 then retrieves the unprocessed substrate forposition in the first substrate holder 204 for processing in one or moreof the process chambers 108 circumscribing the transfer chamber 104.After substrate transfer is completed, the second slit valve 246 isclosed to seal the load lock 106 from the transfer chamber 104.

The vent passage 230 is opened in the load lock 106 to allow thepressure in the load lock 106 to rise to substantially match thepressure in the factory interface 102. While venting, the pedestal 242is raised to contact the substrate disposed in the second substrateholder 206. The substrate is cooled by transferring heat through thepedestal 240 to the fluid circulating in the tube 290. The metrologydevice 428 may be utilized to detect a metric of the substrate, forexample, surface defeats. Once, the pressures are matched, the firstslit valve 244 is opened to allow the factory interface robot 120 toaccess the load lock 106 as described above.

Although the teachings of the present invention that have been shown anddescribed in detail herein, those skilled in the art can readily deviseother varied embodiments that still incorporate the teachings and do notdepart from the scope and spirit of the invention.

1. A method for transferring semiconductor substrates between a firstenvironment having a first pressure and a second environment in a vacuumchamber having a vacuum pressure using a single load lock chamber, themethod comprising: transferring a single substrate from the firstenvironment to a first substrate holder in the load lock chamber whilethe load lock chamber is open to the first environment; determining ametric of the substrate by viewing the substrate through a windowdisposed in a top of the load lock chamber; evacuating the load lockchamber; and removing the substrate into the second environment.
 2. Amethod for transferring semiconductor substrates between a firstenvironment having a first pressure and a second environment having avacuum pressure using a single load lock chamber, the method comprising:transferring a substrate to a first substrate holder; determining ametric of the substrate by viewing the substrate through a windowdisposed in a top of the chamber; evacuating the chamber; and removingthe substrate into the second environment, wherein the determining themetric of the substrate further comprises: moving a cooling plate tocontact the substrate; rotating the cooling plate and substrate; anddetermining an orientation or center of the substrate.
 3. The method ofclaim 1, wherein the substrate disposed on the first substrate holder isan unprocessed substrate.
 4. The method of claim 3 further comprising:transferring a processed substrate from the second environment to asecond substrate holder disposed in the load lock chamber; moving acooling plate to contact the processed substrate; venting the load lockchamber; and removing the processed substrate into the firstenvironment.
 5. The method of claim 3 further comprising: heating theunprocessed substrate disposed on the first substrate holder.
 6. Amethod for transferring semiconductor substrates between a firstenvironment in a factory interface having a first pressure and a secondenvironment in a vacuum chamber having a vacuum pressure using a singleload lock chamber, the method comprising: transferring a processedsubstrate from the second environment to a first substrate holderdisposed in the load lock chamber; moving a cooling plate to contact theprocessed substrate disposed on the first substrate holder; venting theload lock chamber; removing the processed substrate into the firstenvironment; transferring an unprocessed substrate from the firstenvironment to a second substrate holder above the first substrateholder; heating the unprocessed substrate disposed on the secondsubstrate holder; evacuating the load lock chamber; determining a metricof the processed and/or unprocessed substrate while the respectivesubstrate is disposed in the load lock chamber; and then removing theunprocessed substrate into the second environment.
 7. A method fortransferring semiconductor substrates between a first environment havinga first pressure and a second environment having a vacuum pressure usinga single load lock chamber, the method comprising: transferring aprocessed substrate from the second environment to a first substrateholder disposed in the chamber; moving a cooling plate to contact theprocessed substrate disposed on the first substrate holder; venting thechamber; removing the processed substrate into the first environment;transferring an unprocessed substrate from the first environment to asecond substrate holder above the first substrate holder; heating theunprocessed substrate disposed on the second substrate holder;evacuating the chamber; removing the unprocessed substrate into thesecond environment; and determining a metric of the processed and/orunprocessed substrate, wherein the step of determining the metric of theunprocessed substrate further comprises: moving the cooling plate tocontact the unprocessed substrate; rotating the cooling plate andunprocessed substrate; and determining an orientation or center of theunprocessed substrate.